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    The Wires Behind Wireless

    MIPI Previews Debug and Test Specifications at TestConX 2019

    MIPI Alliance was well-represented at TestConX 2019, the premier conference on testing of integrated circuits, which took place in Mesa, Arizona, in early March. TestConX is in its 20th year and evolved from the BiTS (Burn-In & Test Strategies) Workshop to now include system-level testing and validation (hence, the name change).

    I presented along with two of my colleagues from Intel – Rolf Kühnis, Senior Principal Engineer, and Brad Smith, Systems Architect. Our presentations focused on MIPI innovations for mobile device debug and test, including previews of two specifications coming this year that are optimized for low-bandwidth interfaces: MIPI Debug for I3CSM and MIPI SneakPeek ProtocolSM v2.0, which introduces the “TinySPP” style. TestConX gave us the opportunity to share these new technologies with the larger test and validation community.

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    Tags: Debug, Test

    MIPI I3C: Spurring Innovation in Sensor Integration and Beyond

    At SEMI’s Flexible Hybrid Electronics (FLEX) and MEMS & Sensors Technical Congress (MSTC) conference last month in Monterey, Calif., much of the buzz surrounded the astonishing projected growth in the demand for sensors in virtually everything, from such seemingly diverse applications as autonomous driving systems to large-scale crop moisture management.

    But regardless of whether these sensors will be targeted for wearables, industrial applications, automotive applications or agriculture, integration is key. And, anywhere sensors are used, MIPI I3C® offers the ability to simplify the integration process, reducing costs and speeding time to market. With this in mind, Ken Foust, sensor technologist at Intel, and chair of both the MIPI Sensor and I3C Basic Ad Hoc working groups, was invited to provide an update on MIPI I3C advancements since the specification was released to MIPI members in 2016.

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    Tags: I3C

    Powering AI and Automotive Applications with the MIPI Camera Interface

    Editor’s note: MIPI CSI-2 over C-PHY, D-PHY and the upcoming A-PHY are end-to-end imaging conduit solutions mapped to mobile, client (e.g., notebooks and all-in-one PCs), IoT and autonomous (e.g., automotive and drone) platforms, and support a broad range of imaging and vision applications. This article highlights automotive-related use cases and capabilities using CSI-2 over D-PHY.

     
    The initial version of MIPI CSI-2SM, released in November 2005, was designed to connect cameras to processors in mobile phones. But like many MIPI specifications, MIPI CSI-2 quickly found its way into other applications and has become the de facto standard for camera interfaces for automotive, drones, augmented/virtual reality (AR/VR) headsets and Internet of Things (IoT) devices.

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    Tags: Automotive, Camera, AI

    MIPI Software – A Conversation with Software Working Group Chair Rob Gough

    Q: Software is a relatively new area for MIPI. Why was it added and how does it help the mobile ecosystem and developers?

    MIPI Alliance formed the Software Working Group in 2014 to foster easier software integration of MIPI-compliant components and devices in mobile and other devices, such as IoT.

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    Tags: Software

    Featured in ECN: MIPI and Wired Connectivity Standards in Automotive

    As MIPI recently celebrated 15 years of developing interfaces for the mobile industry, the benefits of standardization for wired interfaces have proved extensible to industries well beyond mobile. In the case of automotive, for example, the development of common interfaces for the connectivity of autonomous functions like sensing, processing and acting has the potential to improve the economy of scale to reduce cost and improve the integration of advanced functions. [Figure 1 shown above: Automotive functions leveraging the smartphone.]

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    Tags: Automotive, News

    MIPI 5G Readiness Featured in RCR Wireless News

    From IoT communications to mobile video, organizations already have plans to utilize 5G. A recent Gartner survey revealed that 66% of organizations have plans to deploy 5G by 2020. Fortunately, the MIPI Alliance has been working hard to ensure that the high-speed mobile interfaces that devices need to keep up with 5G are ready.

    In fact, the first generation of 5G smartphones already use MIPI interface specifications and these specifications will meet device performance needs through 2021.

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    Tags: 5G, News