Since the MIPI Alliance introduced MIPI SoundWire® in 2014, manufacturers have taken advantage of the common and scalable audio interface to bring advanced audio features to a wide range of mobile, PCs and other devices. Now, MIPI is bringing even more flexibility to the specification with SoundWire v1.2, available now to MIPI members.
Open to all MIPI Alliance members and industry representatives, MIPI DevCon Stuttgart will offer system architects, engineers, designers, test engineers, engineering managers, and business and marketing executives a forum for training, education and networking. Additional details are expected to unfold in the coming weeks, but the agenda already includes two keynote presentations, an update on MIPI Alliance activities, and eight technical presentations by experts in MIPI specifications and their implementation in automotive, 5G, I3C, and much more.
MIPI kicked off 2019 by welcoming 17 new and reinstated members to the Alliance from 1 January — 31 March. We look forward to working with these companies joining the 300+ MIPI members worldwide developing and implementing MIPI specifications.
Join us at MIPI DevCon Stuttgart at the Maritim Stuttgart Hotel on 25 June to learn how MIPI technology is facilitating new capabilities within mobile and being extended to markets such as IoT, automotive, wearables, industrial and augmented/virtual reality.
Open to all MIPI Alliance members and industry representatives, the event will focus on offering developers and implementers of MIPI specifications a forum for training, education and networking. Register by 11 June to take advantage of the reduced early bird rate of $49.
MIPI Alliance Member Meeting #50 in Montreal has concluded with a packed agenda. More than 150 representatives from 61 MIPI member companies convened for productive working group sessions, informative presentations and networking opportunities to advance specification development and engage in important planning for the Alliance.
MIPI Alliance was well-represented at TestConX 2019, the premier conference on testing of integrated circuits, which took place in Mesa, Arizona, in early March. TestConX is in its 20th year and evolved from the BiTS (Burn-In & Test Strategies) Workshop to now include system-level testing and validation (hence, the name change).
I presented along with two of my colleagues from Intel – Rolf Kühnis, Senior Principal Engineer, and Brad Smith, Systems Architect. Our presentations focused on MIPI innovations for mobile device debug and test, including previews of two specifications coming this year that are optimized for low-bandwidth interfaces: MIPI Debug for I3CSM and MIPI SneakPeek ProtocolSM v2.0, which introduces the “TinySPP” style. TestConX gave us the opportunity to share these new technologies with the larger test and validation community.