Join the Mailing List

    MIPI Alliance Blog:

    The Wires Behind Wireless

    Addressing the Challenges in High-Volume Production Testing of MIPI-Specification-Based Devices

    The latest trend for semiconductor device manufacturers is to add several high-speed MIPI® specification-based ports to a single device. This enables feature-rich implementations of imaging- and display-intensive applications, although it also poses significant challenges for production test engineers who are tasked with creating high-fault coverage testing solutions on automated test equipment (ATE). Such fault coverage often entails creating a parallel, at-speed, system-oriented functional test while simultaneously grappling with the limitations of legacy ATE and the complexity of the MIPI protocols being tested. This post describes production testing methodologies of MIPI-based devices on any ATE platform, whether it is at the wafer test stage or the final test stage.

    Read More
    Tags: Camera, Test, D-PHY, C-PHY

    MIPI CSI-2 Interoperability Aided by New Conformance Test Suites

    Implementers of the most widely used camera interface in mobile and other markets now have a new toolset to support their interoperability and conformance efforts. The MIPI Camera Working Group recently released conformance test suites (CTSs) for the four most recent versions of its MIPI Camera Serial Interface 2 (MIPI CSI-2℠) specification.

    Read More
    Tags: Camera, Test

    MIPI Previews Debug and Test Specifications at TestConX 2019

    MIPI Alliance was well-represented at TestConX 2019, the premier conference on testing of integrated circuits, which took place in Mesa, Arizona, in early March. TestConX is in its 20th year and evolved from the BiTS (Burn-In & Test Strategies) Workshop to now include system-level testing and validation (hence, the name change).

    I presented along with two of my colleagues from Intel – Rolf Kühnis, Senior Principal Engineer, and Brad Smith, Systems Architect. Our presentations focused on MIPI innovations for mobile device debug and test, including previews of two specifications coming this year that are optimized for low-bandwidth interfaces: MIPI Debug for I3CSM and MIPI SneakPeek ProtocolSM v2.0, which introduces the “TinySPP” style. TestConX gave us the opportunity to share these new technologies with the larger test and validation community.

    Read More
    Tags: Debug, Test