Since its introduction in 2007, MIPI UniPro® has been incorporated into multiple versions of the JEDEC Solid State Technology Association's Universal Flash Storage (UFS) standard as its transport and link layers, along with MIPI M-PHY® serving as its physical layer. A major update to the versatile, application-agnostic MIPI UniPro transport layer for chip-to-chip/interprocessor communication (IPC) applications was recently released to MIPI Alliance members and includes new features developed in collaboration with JEDEC for its upcoming UFS 4.0.
MIPI's M-PHY® v4.1 and UniPro® v1.8 specifications feature powerful innovations that increase the performance and quality of mobile device interconnects. In flash storage interconnects, the M-PHY physical layer and UniPro link layer form an ideal combination.
Let's take a look at a few use cases for these specifications.