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    The Wires Behind Wireless

    January 26 A-PHY Automotive Industry Forum: See What’s New, Steer What’s Next

    Written by: Dervla O'Reilly, MIPI Senior Event Manager
    20 January 2022

    Interested in learning more about the updates in the recently released MIPI A-PHY℠ v1.1? Would you like to weigh in on future development of the SerDes interface? You'll have the opportunity for both at next week's MIPI A-PHY Automotive Industry Forum.

    Register to join us on 26 January, 08:00-09:30 (PST), for a technical overview of A-PHY v1.1, followed by the opportunity to provide input on industry requirements and enhancements to help shape the next version of the specification.

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    Tags: MIPI A-PHY, Automotive

    2021 Highlights Set the Stage for 2022

    Written by: Peter Lefkin, MIPI Managing Director
    14 January 2022

    Propelled by the momentum of a record-breaking year of specification adoptions and membership growth, along with other major strategic advancements, MIPI Alliance embarks upon 2022 securely positioned to continue advancing mobile, IoT, automotive and related marketplaces.  

    I encourage you to check out the 2021 Year in Review for a full picture of the range of accomplishments that will fuel important new efforts over the next year—from the development of 2022–2023 Strategic Priorities, to completion of another double-digit number of specifications, to new virtual and in-person education and engagement opportunities.

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    Tags: MIPI Alliance

    Welcome New Members – Q4 2021

    Membership continued its upward trend in Q4, closing out the year with 10 new Adopter members and one Contributor member joining MIPI Alliance from 1 October to 31 December. In total, MIPI welcomed 84 new members in 2021.

    We look forward to working with these companies that are joining the nearly 400 MIPI Alliance members worldwide developing and implementing MIPI specifications.

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    Latest IoT Kits with MIPI Camera, Display, I3C and JEDEC UFS Give Developers a Fast Track For Designs

    It's been more than 12 months since we published our last blog post highlighting popular IoT developer kits that support MIPI camera and display interfaces. Since then, a number of new kits have been launched that support other MIPI interfaces, including MIPI I3C® (the successor to the I2C interface) and JEDEC Universal Flash Storage (which leverages MIPI M-PHY® and MIPI UniPro®), in addition to the already widely adopted MIPI CSI-2® camera and MIPI DSI®/DSI-2 display interfaces.  

    This blog highlights some of the notable kits new to the market over the last year (and one particular kit missing from the previous post). I’ll explain which MIPI interfaces they support and describe how the use of these interfaces can benefit the IoT developer community.

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    Tags: Camera, Display, MIPI Debug for I3C, IoT

    HTI v1.1 Tightens Electrical Properties To Boost Trace Reliability at Higher Speeds

    For those involved in debug and trace projects, one of the fundamental challenges is how to extract greater volumes of trace data from ever more complex devices, using ever-increasing higher-speed serial interfaces. This challenge is driven by the product of more—more data being transmitted inside devices, more functions happening at once on a die, and more components being integrated within devices. And the challenge is universal regardless of the application area—whether it's the Internet of Things (IoT), automotive, 5G or other areas. 

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    Tags: Debug, MIPI HTI

    M-PHY v5.0 Driven By Next-Generation Flash Memory Storage Applications

    MIPI Alliance's versatile M-PHY® physical-layer (PHY) interface offers engineers configuration choices and the ability to address multiple markets and use cases with designs for interconnecting components in advanced 5G smartphones, wearables, PCs and even larger systems such as automobiles. A new update to the specification, version 5.0, doubles its peak data rate and positions M-PHY for the next generation of flash memory storage applications.

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    Tags: MIPI M-PHY
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