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    The Wires Behind Wireless

    Sharmion Kerley, MIPI Director of Marketing and Membership

    Sharmion Kerley, MIPI Director of Marketing and Membership

    Recent Posts

    MIPI Protocol Adaptation Layers (PALs) — A Conversation with Raj Kumar Nagpal

    Update: MIPI A-PHY was adopted as an IEEE standard in June 2021 and is also available as IEEE 2977-2021.

    MIPI Alliance is rolling out a portfolio of Protocol Adaptation Layers (PALs) to support a range of important automotive sensor and display applications—advanced driver assistance systems (ADAS), autonomous driving systems (ADS) and in-vehicle infotainment (IVI), among others. The PALs enable upper-layer protocols such as MIPI Camera Serial Interface (CSI-2®) and Display Serial Interface (DSI-2SM) to be transported over MIPI A-PHYSM, the first industry-standard, long-reach serializer-deserializer (SerDes) physical layer interface.

    Raj Kumar Nagpal, interim chair of the MIPI PHY Working Group and lead of the MIPI A-PHY Subgroup, talks about how the PALs support A-PHY, as well as their contribution to the broader system of MIPI automotive connectivity solutions currently under development.

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    MIPI in the News: A-PHY in EE Times and RFFE in IEEE Future Networks

    Two of the most significant MIPI highlights of 2020 were the eagerly anticipated releases of MIPI RFFE v3.0SM in April and MIPI A-PHYSM v1.0 in September. With the rollout of 5G well underway, and the rapid advancements in ADAS, ADS and IVI automotive applications, these specifications have generated tremendous interest for their roles in enabling these profound transformations.

    To share more about what these new specifications bring to their respective ecosystems, both were recently highlighted in industry publications. Here’s a look:

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    The Power of Collaboration — A Conversation with Joel Huloux

    Update: MIPI A-PHY was adopted as an IEEE standard in June 2021 and is also available as IEEE 2977-2021.

    Recently MIPI Alliance announced it had signed a memorandum of understanding (MoU) with IEEE, the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. Under the agreement, MIPI A-PHYSM v1.0 will be brought forward through the adoption process to become an IEEE standard. In this Q&A, Joel Huloux, chairman of MIPI Alliance, discusses the significance of this announcement and the importance of liaison relationships, and shares a look ahead at what’s to come for MIPI Alliance.

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    Tags: MIPI A-PHY, Automotive

    Advancing Automotive Interoperability, Choice and Economies of Scale via Collaboration with IEEE

    Update: MIPI A-PHY was adopted as an IEEE standard in June 2021 and is also available as IEEE 2977-2021.

    The MIPI A-PHYSM v1.0 specification, which has been available to MIPI Alliance members since September 2020, is now positioned for wider availability to the broader automotive ecosystem.

    As detailed in an October 13 press release, under terms of a memorandum of understanding (MOU) with IEEE, the A-PHY serializer-deserializer (SerDes) specification will be put forward for adoption as an IEEE standard, which will result in broader global availability and, ultimately greater interoperability, choice and economies of scale for the global automotive industry.

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    Tags: MIPI A-PHY, MIPI Alliance

    MIPI Debug for I3C v1.0 Now Available

    The smaller and more power-constrained systems being developed today for the Internet of Things (IoT), mobile devices, automotive and other use cases demonstrate the value of low-bandwidth interfaces for debug and trace. At the same time, the flexibility and scalability that these new use cases require have revealed crucial shortcomings in legacy low-bandwidth interfaces that are structured statically, such as JTAG/cJTAG, I2C and UART.

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    Tags: Debug

    MIPI Lifetime Achievement Award and MIPI Camera Working Group – A Conversation with Tom Kopet

    Q: Congrats on your recent MIPI Lifetime Achievement award. Tell us how long you’ve been involved with MIPI, which working groups you participate in and a bit about your background.

    Thank you! It’s still surprising to me that I’ve been involved with MIPI for over 15 years. My technical career began about 40 years ago in the aerospace defense business, initially focused on DSP and image processing software and algorithms, and later moving to digital chip architectures and systems for applications such as high-speed IEEE floating point arithmetic and real-time MPEG video compression. I joined Micron Imaging in 2003, the precursor to Aptina Imaging, and image sensors have been my focus since then. Aptina was acquired by ON Semiconductor in 2014, and I’ve had the privilege of successively representing Micron, Aptina, and ON as a MIPI Camera Working Group (CWG) member since the early days of the group. I’ve served as CWG vice chair for the last four years or so. I also occasionally participate in the PHY working group and generally try to keep up with most MIPI technical activities.

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    Tags: Camera
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