Since its introduction in 2007, MIPI UniPro® has been incorporated into multiple versions of the JEDEC Solid State Technology Association's Universal Flash Storage (UFS) standard as its transport and link layers, along with MIPI M-PHY® serving as its physical layer. A major update to the versatile, application-agnostic MIPI UniPro transport layer for chip-to-chip/interprocessor communication (IPC) applications was recently released to MIPI Alliance members and includes new features developed in collaboration with JEDEC for its upcoming UFS 4.0.
To satisfy the demand for both advanced safety features and better driver and passenger experiences, automakers are adding more displays, larger in size and with greater resolutions, to the digital cockpit. This trend has created a need for more in-vehicle wiring, which in turn adds cost, weight and complexity to new car designs.
This is one of the many challenges being addressed by the introduction of MIPI Automotive SerDes Solutions, or MASS for short, which offers a standardized framework for integrating cameras and displays with their associated electronic control units (ECUs) using the MIPI A-PHYSM asymmetric SerDes physical layer as its foundation.
Over the past year, MIPI has adopted a record number of new and updated interface specifications for mobile, the Internet of Things (IoT), automotive and related industries. Three key 2021 releases in particular have garnered significant media interest and coverage:
Following the recent announcement by longtime chair Joel Huloux (STMicroelectronics) of his upcoming retirement, the MIPI Alliance Board of Directors has appointed new leadership for the first time in nearly a decade. As detailed in a 5 April 2022 press release, Sanjiv Desai (Intel Corporation), MIPI’s vice chair since 2013, was appointed chair and board member Rick Wietfeldt (Qualcomm Incorporated) has been appointed vice chair. The transition became effective March 23.
A recent collaboration between the MIPI I3C Working Group and the USB Implementers Forum (USB-IF) has resulted in a new USB-IF specification that dramatically expands the possible use cases and ecosystem for both the Universal Serial Bus (USB) standard and MIPI I3C®/I3C BasicSM, the two-wire utility and control bus interface designed as the successor to I2C.
A major update to the world’s most widely implemented embedded camera and imaging interface delivers a scalable foundation upon which next-generation artificial intelligence and machine‑vision systems can enhance human-device interaction. Version 4.0 of the MIPI Camera Serial Interface 2 (MIPI CSI-2®) introduces key new features that continue to build on CSI-2's capabilities to bring sight to artificial intelligence (AI) and support advanced machine-vision applications across multiple application spaces, such as mobile, augmented and virtual reality, drones, the Internet of Things (IoT), medical devices, industrial systems, automobiles, and client devices including tablets, notebooks and all-in-ones.
Originally introduced in 2005, MIPI CSI-2 is a lane-scalable, high-speed protocol for the transmission of still and video images from image sensors to application processors. The specification supports a broad range of use cases that require high performance, low power and low electromagnetic interference (EMI).