MIPI Alliance was well-represented at TestConX 2019, the premier conference on testing of integrated circuits, which took place in Mesa, Arizona, in early March. TestConX is in its 20th year and evolved from the BiTS (Burn-In & Test Strategies) Workshop to now include system-level testing and validation (hence, the name change).
I presented along with two of my colleagues from Intel – Rolf Kühnis, Senior Principal Engineer, and Brad Smith, Systems Architect. Our presentations focused on MIPI innovations for mobile device debug and test, including previews of two specifications coming this year that are optimized for low-bandwidth interfaces: MIPI Debug for I3CSM and MIPI SneakPeek ProtocolSM v2.0, which introduces the “TinySPP” style. TestConX gave us the opportunity to share these new technologies with the larger test and validation community.