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    MIPI Alliance Blog:

    The Wires Behind Wireless

    Sharmion Kerley, MIPI Director of Marketing and Membership

    Sharmion Kerley, MIPI Director of Marketing and Membership

    Recent Posts

    MIPI I3C v1.1 – A Conversation with Ken Foust

    Q: What makes the newly released MIPI I3C® v1.1 different from v1.0, and why is it important to developers?

    I see Version 1.0 as setting a new baseline. We came together to make an interface that would dramatically simplify the integration of sensors and address many of the key pain points that all of us in the industry were dealing with when working with I2C and SPI interfaces. We think we accomplished that with v1.0—anywhere sensors are used, MIPI I3C belongs. Now v1.1 is the first update to build on that foundation.

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    Tags: I3C

    MIPI Debug and Trace Featured in Embedded Computing Design and Electronics Media

    Earlier this year, the full lineup of MIPI debug and trace specifications was made available to the broader community, giving developers not only a standard, layered set of interfaces and protocols, but also an alternative to using expensive proprietary testing tools.

    In recent articles in Electronics Media and Embedded Computing Design, Enrico Carrieri, chair of the MIPI Debug Working Group, shares how MIPI Alliance’s broad portfolio of debug and trace specifications can be used to streamline development for mobile, Internet of Things (IoT), 5G, automotive and many other applications.

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    Tags: Debug, Trace

    Featured in Electronic Design: MIPI I3C and I3C Basic

    Several months ago, MIPI I3C BasicSM, a subset of the MIPI I3C bus interface, was made available to the broader developer community without MIPI membership to foster greater interoperability and innovation in industries beyond mobile, including IoT and automotive.

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    Tags: I3C

    An Automotive Analyst’s Perspective – A Conversation with Antonio Garzón

    Q: Briefly, how would you characterize the current automotive electronics market?

    Despite stagnant vehicle production levels around the world and the tariff war’s impact on the semiconductor markets, the proliferation of electronics found in cars will still continue to grow. This growth is boosted by the connectivity, electrification and autonomy trends that have been taking shape for several years. The current disruption of the vehicle architecture represents a great challenge for the whole automotive electronics supply chain, and we are already seeing a lot of movement with startups, mergers, acquisitions and interesting partnerships at every level.

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    Tags: Automotive

    Automotive Applications Drive MIPI A-PHY Development

    Q: In August 2018, MIPI Alliance announced development work had begun on MIPI A-PHYSM. What is A-PHY?

    MIPI A-PHY is a physical layer specification targeted for advanced driver-assistance systems (ADAS) and autonomous driving systems (ADS) and other surround sensor applications in automotive (e.g., for displays, cameras), but also for other longer-reach applications such as IoT and industrial. While most MIPI specifications are designed for shorter reaches for use within mobile devices, A-PHY will be capable of reaching up to 15 meters in the demanding automotive environment.

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    Tags: Automotive, A-PHY

    MIPI I3C: Spurring Innovation in Sensor Integration and Beyond

    At SEMI’s Flexible Hybrid Electronics (FLEX) and MEMS & Sensors Technical Congress (MSTC) conference last month in Monterey, Calif., much of the buzz surrounded the astonishing projected growth in the demand for sensors in virtually everything, from such seemingly diverse applications as autonomous driving systems to large-scale crop moisture management.

    But regardless of whether these sensors will be targeted for wearables, industrial applications, automotive applications or agriculture, integration is key. And, anywhere sensors are used, MIPI I3C® offers the ability to simplify the integration process, reducing costs and speeding time to market. With this in mind, Ken Foust, sensor technologist at Intel, and chair of both the MIPI Sensor and I3C Basic Ad Hoc working groups, was invited to provide an update on MIPI I3C advancements since the specification was released to MIPI members in 2016.

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    Tags: I3C